SPEE3D demonstrates additive manufacturing to US military

Metal additive manufacturing company SPEE3D has successfully participated in the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory (ARL) advanced manufacturing demonstration at the University of Tennessee Knoxville.

The goal of the exercise was to train a soldier with no previous additive manufacturing training or experience to print a crucial part that can be used to build or repair equipment in the field or at a deployed location – the trial was successful.

The soldier, who had no experience using SPEE3D’s proprietary cold spray additive manufacturing (CSAM) technology, printed a Bradley Fighting Vehicle’s transmission mount.

The part was installed in a Bradley and the vehicle was take out on multiple test cycles through the 278th field test area. Upon return, the part was examined and showed no degradation.

This exercise proved that SPEE3D’s CSAM technology can successfully create a repair part and restore the vehicle to operational capability returning it to the fight. VRC Metal Systems was also involved in the additive manufacturing demonstration.

The CEO of SPEE3D Byron Kennedy said “SPEE3D intends to make additive manufacturing accessible as a quick, cost-effective, and easy way to print crucial metal parts that otherwise would not be available at the point of need.

“Having a soldier with no previous additive manufacturing experience learn our technology within a week certainly meets that goal”

Materials Engineer at DEVCOM ARL Michael Nicholas said the demonstration successfully illustrated how cold spray technology can be utilised to positively impact the warfighter in expeditionary scenarios

Nicholas said: “Expeditionary cold systems provide added repair and manufacturing capabilities which can address supply chain challenges as would be expected in a contested logistics environment.

“Overall, this advanced manufacturing demonstration was extremely successful due to our amazing partnerships with industry, academia and future technology users.”

Picture: SPEE3D